Capacitor component

ABSTRACT

A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2018-0158909 filed on Dec. 11, 2018 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a capacitor component.

2. Description of Related Art

A multilayer ceramic capacitor (MLCC), a capacitor component, may be achip type capacitor which is mounted on the printed circuit boards ofvarious electronic products and plays a role in charging or dischargingelectricity therein or therefrom, for example, an imaging device such asa liquid crystal display (LCD), a plasma display panel (PDP), and thelike, a computer, a smartphone, a mobile phone, or the like.

Such a multilayer ceramic capacitor may be used as a component ofvarious electronic devices, due to having a relatively compact size,relatively high capacity, relative ease of mounting, and the like. Aselectronic devices such as computers and mobile devices become smallerin size and higher in power output, demand for miniaturization andhigher capacity in multilayer ceramic capacitors are increasing.

In the meantime, as interest, in industry, in electric/electroniccomponents has recently increased, multilayer ceramic capacitors havealso been required to have high reliability and high capacity in orderto be used in vehicles or infotainment systems.

A problem in such high reliability may occur due to penetration ofplating liquid occurring during the process, occurrence of cracks due toexternal impacts, or the like.

In order to solve the above problems, a resin composition containing aconductive material has been applied between an electrode layer and aplated layer of an external electrode so as to form a conductive resinlayer, thereby absorbing external impacts and preventing the penetrationof plating liquid, to improve reliability.

However, when the conductive resin layers was applied between theelectrode layer and the plated layer of the external electrode, therewere problems, in that a lifting phenomenon occurred between theelectrode layer and the resin layer, and a non-plating phenomenonoccurred between the plated layer and the resin layer.

In addition, it has been susceptible to bending strength, such thatcracks occurred inside the chip, and adhesion on a ceramic substrate anda silicon substrate were not good.

Therefore, in order to secure higher reliability, a relatively highlevel of crack resistance property is required.

SUMMARY

An aspect of the present disclosure is to provide a capacitor componentwith improved crack resistance.

According to an aspect of the present disclosure, a capacitor componentincludes a body including dielectric layers and internal electrodesalternately arranged with the dielectric layers; and external electrodesincluding electrode layers disposed on the body and connected to theinternal electrodes, first conductive resin layers disposed on theelectrode layers, and second conductive resin layers disposed on thefirst conductive resin layers, wherein the first and second conductiveresin layers include a metal powder and a base resin, the firstconductive resin layers have a lower metal powder content than thesecond conductive resin layers, the metal powder includes one or more ofa flake-type powder particle and spherical-type powder particle, and aweight ratio of the flake-type powder particle in the metal powdercontained in the first conductive resin layers is 60% or more, and aweight ratio of the spherical-type powder particle in the metal powdercontained in the second conductive resin layers is 50% or more.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings.

FIG. 1 is a perspective view schematically illustrating a capacitorcomponent according to an embodiment of the present disclosure.

FIG. 2 is a schematically cross-sectional view taken along line I-I′ ofFIG. 1.

FIG. 3 illustrates a dielectric layer on which a first internalelectrode is printed, and

FIG. 4 illustrates a dielectric layer on which a second internalelectrode is printed.

FIG. 5 is an enlarged view illustrating area P1 in FIG. 2.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

Hereinafter, embodiments of the present disclosure will be describedwith reference to specific embodiments and the accompanying drawings.However, embodiments of the present disclosure may be modified to havevarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Further, embodiments of thepresent disclosure may be provided for a more complete description ofthe present disclosure to those skilled in the art. Accordingly, theshapes and sizes of the elements in the drawings may be exaggerated forclarity of description, and the elements denoted by the same referencenumerals in the drawings may be the same elements.

In order to clearly illustrate the present disclosure, portions notrelated to the description are omitted, and thicknesses are enlarged inorder to clearly represent layers and regions, and similar portionshaving the same functions within the same scope are denoted by similarreference numerals throughout the specification. Further, throughout thespecification, when an element is referred to as “comprising”, it meansthat it may include other elements as well, rather than excluding otherelements, unless specifically stated otherwise.

In the drawing, an X direction may be defined as a second direction, anL direction or a longitudinal direction, a Y direction may be defined asa third direction, a W direction or a width direction, and a Z directionmay be defined as a first direction, a stacking direction, a Tdirection, or a thickness direction.

Capacitor Component

FIG. 1 is a perspective view schematically illustrating a capacitorcomponent according to an embodiment of the present disclosure.

FIG. 2 is a schematically cross-sectional view taken along line I-I′ ofFIG. 1.

FIG. 3A illustrates a dielectric layer on which a first internalelectrode is printed, and FIG. 3B illustrates a dielectric layer onwhich a second internal electrode is printed.

FIG. 4 is an enlarged view illustrating area P1 in FIG. 2.

Hereinafter, a capacitor component according to an embodiment of thepresent disclosure will be described in detail with reference to FIGS. 1to 4.

A capacitor component 100 according to an embodiment of the presentdisclosure may include a body 110 including dielectric layers 111 andinternal electrodes 121 and 122 alternately arranged with the dielectriclayers; and external electrodes 131 and 132 including electrode layers131 a and 132 a disposed on the body and connected to the internalelectrodes, first conductive resin layers 131 b and 132 b disposed onthe electrode layers, and second conductive resin layers 131 c and 132 cdisposed on the first conductive resin layers, wherein the first andsecond conductive resin layers 131 b, 132 b, 131 c, and 132 c include ametal powder and a base resin, and the first conductive resin layers 131b and 132 b have a lower metal powder content than the second conductiveresin layers 131 c and 132 c. The metal powder includes one or more offlake-type powder particle (f) and spherical-type powder particle (s),and a weight ratio of the flake-type powder particle (f) in the metalpowder contained in the first conductive resin layers 131 b and 132 b is60% or more, and a weight ratio of the spherical-type powder particle(s) in the metal powder contained in the second conductive resin layers131 c and 132 c is 50% or more.

The body 110 may have the dielectric layers 111 and the internalelectrodes 121 and 122, alternately stacked.

A shape of the body 110 is not particularly limited, but as illustrated,the body 110 may have a hexahedral shape or a similar shape. Due toshrinkage of a ceramic powder contained in the body 110 during asintering process, the body 110 may have a substantially hexahedralshape, although a hexahedral shape having completely straight lines isnot included.

The body 110 may have first and second surfaces 1 and 2 disposedopposite to each other in a thickness direction (a Z direction); thirdand fourth surfaces 3 and 4 connected to the first and second surfaces 1and 2 and disposed opposite to each other in a length direction (an Xdirection); and fifth and sixth surfaces 5 and 6 connected to the firstand second surfaces 1 and 2, connected to the third and fourth faces 3and 4, and disposed opposite to each other in a width direction (a Ydirection).

The plurality of dielectric layers 111 forming the body 110 may be in asintered state, and boundaries between neighboring dielectric layers 111may be integrated such that it is difficult to identify without using ascanning electron microscope (SEM).

According to one embodiment of the present disclosure, a raw materialfor forming the dielectric layer 111 is not particularly limited as longas a sufficient electrostatic capacity may be obtained. For example, abarium titanate-based material, a lead composite perovskite-basedmaterial, a strontium titanate-based material, or the like may be used.

A variety of ceramic additives, organic solvents, plasticizers, binders,dispersants, and the like may be added to powder particle of bariumtitanate (BaTiO₃), depending on the purpose of the present disclosure.

The body 110 may include a capacitance formation portion disposed insidethe body 110 and including a first internal electrode 121 and a secondinternal electrode 122 arranged to face each other with the dielectriclayer 111 interposed therebetween, to form capacitance; and coverportions 112 and 113 formed on and below the capacitance formationportion.

The capacitance formation portion may be a portion contributing tocapacitance formation of a capacitor, and may be formed by repeatedlystacking the plurality of first and second internal electrodes 121 and122 with the dielectric layer 111 interposed therebetween.

An upper cover portion 112 and a lower cover portion 113 may be formedby stacking a single dielectric layer or two or more dielectric layerson upper and lower surfaces of the capacitance formation portion in thevertical direction, respectively, and may function to basically preventthe internal electrodes from being damaged by physical or chemicalstress.

The upper cover portion 112 and the lower cover portion 113 may notinclude internal electrodes, and may include the same material as thedielectric layer 111.

The plurality of internal electrodes 121 and 122 may be disposed to faceeach other with the dielectric layer 111 interposed therebetween.

The internal electrodes 121 and 122 may include a first internalelectrode 121 and a second internal electrode 122, alternately arrangedto face each other with a dielectric layer interposed therebetween.

The first and second internal electrodes 121 and 122 may be exposed tothe third and fourth surfaces 3 and 4 of the body 110, respectively.

Referring to FIG. 2, the first internal electrode 121 may be spacedapart from the fourth surface 4, and may be exposed through the thirdsurface 3, and the second internal electrode 122 may be spaced apartfrom the third surface 3, and may be exposed through the fourth surface4. The first external electrode 131 may be disposed on the third surface3 of the body and connected to the first internal electrode 121, and thesecond external electrode 132 may be disposed on the fourth surface 4 ofthe body and connected to the second internal electrode 122.

The first and second internal electrodes 121 and 122 may be electricallyseparated from each other by the dielectric layer 111 disposed in amiddle portion.

Referring to FIGS. 3A and 3B, a body 110 may be formed by stackingalternatively and sintering a dielectric layer 111 on which a firstinternal electrode 121 is printed, and a dielectric layer 111 on which asecond internal electrode 122 is printed, in the thickness direction(the Z direction).

Materials for forming the first and second internal electrodes 121 and122 are not particularly limited, and may be formed by using aconductive paste including a noble metal material such as palladium(Pd), a palladium-silver (Pd—Ag) alloy, or the like, and one or morematerials of nickel (Ni) and copper (Cu).

The conductive paste may be printed by a screen printing method or agravure printing method, but the present disclosure is not limitedthereto.

External electrodes 131 and 132 may be disposed on the body 110 andconnected to the internal electrodes 121 and 122, respectively, and mayinclude a first external electrode 131 and a second external electrode132 connected to the first and second internal electrodes 121 and 122,respectively, as illustrated in FIG. 2.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122,respectively, to form electrostatic capacitance, and the second externalelectrode 132 may be connected to a potential different from that of thefirst external electrode 131.

The external electrodes 131 and 132 may include electrode layers 131 aand 132 a connected to the internal electrodes 121 and 122, firstconductive resin layers 131 b and 132 b disposed on the electrodelayers, and second conductive resin layers 131 c and 132 c disposed onthe first conductive resin layers.

The electrode layers 131 a and 132 a may include a conductive metal anda glass.

A conductive metal used for the electrode layers 131 a and 132 a is notparticularly limited as long as it is a material that may beelectrically connected to the internal electrodes for the formation ofelectrostatic capacitance, and may be, for example, one or more selectedfrom the group consisting of copper (Cu), silver (Ag), nickel (Ni), andalloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste prepared by adding glass frit to a conductive metalpowder and then sintering the paste.

The first and second conductive resin layers 131 b, 132 b, 131 c, and132 c may include a metal powder and a base resin.

The metal powder may function to electrically connect to the electrodelayers 131 a and 132 a, and the base resin may function to ensureadhesion and absorb impacts.

Since the first conductive resin layers 131 b and 132 b have arelatively lower metal powder content than the second conductive resinlayers 131 c and 132 c, the first conductive resin layers 131 b and 132b may increase the adhesion and the bending strength characteristicswith the electrode layers 131 a and 132 a. Further, since the secondconductive resin layers 131 c and 132 c have a relatively high metalpowder content than the first conductive resin layers 131 b and 132 b,the adhesion with a plated layer may be improved, the non-platingphenomenon may be prevented, and the reliability may be improved.

Since the metal powder content of the first conductive resin layers 131b and 132 b is relatively low, an equivalent series resistance (ESR) maybe relatively high, and the electrical connectivity may be deteriorated.Further, since the metal powder content of the second conductive resinlayers 131 c and 132 c is relatively high, the bending strengthcharacteristics may be deteriorated.

According to one embodiment of the present disclosure, a content of theflake-type powder particle (f) in the first conductive resin layers 131b and 132 b may be more than a content of the spherical-type powderparticle (s) in the first conductive resin layers 131 b and 132 b. Thefirst conductive resin layers 131 b and 132 b may increase a ratio ofthe flake-type powder particle (f), to maintain an effect of increasingthe adhesion and the bending strength characteristics with the electrodelayers 131 a and 132 a, to reduce the equivalent series resistance(ESR), and to improve the electrical connectivity. According to oneembodiment of the present disclosure, a content of the spherical-typepowder particle (s) in the second conductive resin layers 131 c and 132c may be equal to or more than a content of the flake-type powderparticle (f) in the second conductive resin layers 131 c and 132 c. Thesecond conductive resin layers 131 c and 132 c may increase a ratio ofthe spherical-type powder particle (s), than the first conductive resinlayers, to maintain an effect of improving the adhesion with the platedlayer, and may increase the elasticity to improve the bending strengthcharacteristics.

A metal powder (f and s) may include at least one of flake-type powderparticle (f) and spherical-type powder particle (s). For example, themetal powder may be composed of only the flake-type powder particle, maybe composed of only the spherical-type powder particle, or may be amixture of the flake-type powder particle and the spherical-type powderparticle.

The weight ratio of the flake-type powder particle (f) in the metalpowders contained in the first conductive resin layers 131 b and 132 bmay be 60% or more. Since the flake-type powder particle has anelongated shape, the electrical connectivity may be efficiently improvedeven with a relatively small electrical amount. The weight ratio of theflake-type powder particle (f) in the metal powders contained in thefirst conductive resin layers 131 b and 132 b may be more than theweight ratio of the spherical-type powder particle (s) in the metalpowders contained in the first conductive resin layers 131 b and 132 b.

When the weight ratio of the flake-type powder particle in the metalpowder contained in the first conductive resin layers 131 b and 132 b isless than 60%, the ESR may increase, and the electrical connectivity maydeteriorate.

An upper limit of the weight ratio of the flake-type powder particle inthe metal powders contained in the first conductive resin layers 131 band 132 b is not particularly limited, and the weight ratio of theflake-type powder particle may be 100%. When the weight ratio of theflake-type powder particle is more than 95%, the appearance defect mayoccur, such that the upper limit thereof may be 95%. In one embodiment,the weight ratio of the flake-type powder particle (f) in the metalpowder contained in the first conductive resin layers 131 b and 132 b is65% or more, 70% or more, 75% or more, 80% or more, 85% or more, or 90%or more. In one embodiment, upper limit of the weight ratio of theflake-type powder particle (f) in the metal powder contained in thefirst conductive resin layers 131 b and 132 b is 90%, 85%, 80%, 75%,70%, or 65%.

Although the flake-type powder particle is not particularly limited, alength ratio (major axis/minor axis) of a major axis to a minor axis maybe, for example, 1.95 or more.

The weight ratio of the spherical-type powder particle (s) in the metalpowder contained in the second conductive resin layers 131 c and 132 cmay be 50% or more. The spherical-type powder particle may haverelatively high elasticity, may absorb the external impact, and improvethe bending strength. The weight ratio of the spherical-type powderparticle (s) in the metal powder contained in the second conductiveresin layers 131 c and 132 c may be equal to or more than the weightratio of the flake-type powder particle (f) contained in the secondconductive resin layers 131 c and 132 c.

When the weight ratio of the spherical-type powder particle in the metalpowder contained in the second conductive resin layers 131 c and 132 cis less than 50%, the weight ratio of the spherical-type powder particlehaving excellent elasticity may become too low, and the bending strengthmay be lowered.

The upper limit of the weight ratio of the spherical-type powderparticle in the metal powder contained in the second conductive resinlayers 131 c and 132 c is not particularly limited, and the weight ratioof the spherical-type powder particle may be 100%. In one embodiment,the weight ratio of the spherical-type powder particle (s) in the metalpowder contained in the second conductive resin layers 131 c and 132 cis 55% or more, 60% or more, 65% or more, 70% or more, 75% or more, 80%or more, 85% or more, 90% or more, or 95% or more. In one embodiment,upper limit of the weight ratio of the spherical-type powder particle(s) in the metal powder contained in the first conductive resin layers131 b and 132 b is 95%, 90%, 85%, 80%, 75%, 70%, 65%, 60% or 55%.

Although the spherical-type powder particle is not particularly limited,a length ratio (major axis/minor axis) of a major axis to a minor axismay be, for example, 1.45 or less.

A method of measuring the lengths of the major axis and the minor axisof the spherical-type powder particle (s) and the flake-type powderparticle (f) may be a method of measuring the X and Z directionalcross-sections (an L-T cross-section) cut at a central portion in thewidth direction (the Y direction) of the capacitor component by ascanning electron microscope (SEM).

The metal powders (f and s) are not particularly limited as long as theymay be electrically connected to the electrode layers 131 a and 132 a.For example, the metal powders (f and s) may include at least oneselected from the group consisting of copper (Cu), silver (Ag), nickel(Ni), and alloys thereof.

A thickness (tc) of the second conductive resin layers may be 10% ormore and 30% or less of a thickness (tb) of the first conductive resinlayers. In one embodiment, the thickness (tc) of the second conductiveresin layers is 15% or more, 20% or more, or 25% or more of thethickness (tb) of the first conductive resin layers. In one embodiment,the thickness (tc) of the second conductive resin layers is 25% or less,20% or less, 15% or less of the thickness (tb) of the first conductiveresin layers.

When the thickness (tc) of the second conductive resin layers is lessthan 10% or more than 30% of the thickness (tb) of the first conductiveresin layer, internal stress generated by a difference in heat shrinkageratio may act on a boundary, adhesion with the electrode layers 131 aand 132 a may not be sufficiently secured to have the liftingphenomenon, the electrical conductivity may be lowered, and the bendingstrength may not be sufficiently secured.

The content of the metal powder in the first conductive resin layers 131b and 132 b may be 60 wt % or less in relation to a total weight of thefirst conductive resin layers 131 b and 132 b, respectively.

When the content of the metal powder in the first conductive resinlayers 131 b and 132 b is more than 60 wt %, the adhesion with theelectrode layers 131 a and 132 a may be lowered, and the liftingphenomenon may occur. A lower limit of the metal powder in the firstconductive resin layers 131 b and 132 b is not particularly limited, butmay be, for example, 20 wt % or more. In one embodiment, the content ofthe metal powder in the first conductive resin layer 131 b and 132 b is55% wt % or less, 50 wt % or less, 45 wt % or less, 40 wt % or less, 35wt % or less, 30 wt % or less, or 25 wt % or less. In one embodiment,the content of the metal powder in the first conductive resin layer 131b and 132 b is 25 wt % or more, 30 wt % or more, 35 wt % or more, 40 wt% or more, 45 wt % or more, 50 wt % or more, or 55 wt % or more.

The content of the metal powder in the second conductive resin layers131 c and 132 c may be 75 wt % or more in relation to a total weight ofthe second conductive resin layers 131 c and 132 c, respectively.

When the content of the metal powder in the second conductive resinlayers 131 c and 132 c is less than 75 wt %, the conductivity may belowered, the electrical connectivity may be lowered, the adhesion withthe plated layers 131 d and 132 d may be lowered, and the non-platingphenomenon may occur.

An upper limit of the metal powder in the second conductive resin layers131 c and 132 c is not particularly limited, but may be, for example, 95wt % or less. In one embodiment, the content of the metal powder in thesecond conductive resin layer 131 c and 132 c is 80 wt % or more, 85 wt% or more, or 90 wt % or more. In one embodiment, the content of themetal powder in the second conductive resin layer 131 c and 132 c is 90wt % or less, 85 wt % or less, or 80 wt % or less.

The base resin is not particularly limited as long as it has theadhesion and the impact-absorbing property and it is mixed with theconductive metal powder to form a paste. For example, the base resin mayinclude an epoxy-based resin.

The base resin included in the first conductive resin layers 131 b and132 b may have a relatively low Young's modulus and relatively hightoughness and flexibility, to further improve crack resistance.

For example, the base resin included in the first conductive resinlayers 131 b and 132 b may include one or more selected from the groupconsisting of an acryl resin, a urethane polymer, and a core-shellrubber.

Examples of the urethane polymer may be one obtained by reactingisophorone diisocyanate (IPDI), methylene diphenyl diisocyanate (MDI),1,4-pentamethylene diisocyanate (1,4-PDI), 4,4′-methylenebis-(cyclohexyl isocyanate) (HMDI), or the like, and a polyol, which maybe used alone or in combination of two or more among them.

The core-shell rubber may be a product sold under the name Kane Ace(manufactured by Kanegafuchi Kagaku Kogyo Kabushikikaisha), Paraloid(manufactured by Rohm and Haas Co., Ltd.), or the like.

The base resin included in the second conductive resin layers 131 c and132 c for high temperature assurance may be a material having relativelyhigh heat resistance, relatively low thermal conductivity, andrelatively high adhesion and glass transition temperature.

For example, the base resin included in the second conductive resinlayers 131 c and 132 c may include one or more selected from the groupconsisting of an ultra-high polymer resin, an oligomer resin, and a highheat-resistant epoxy resin.

For example, as the high heat-resistant epoxy resin, an epoxy resinhaving a rigid structure such as benzene, naphthalene,dicyclopentadiene, or the like, may be used. The ultra-high molecularweight resin has a molecular weight of 50,000 or more, and may beusually usable as long as it is applicable to a paste, and the type ofresin is not particularly limited. The oligomer resin may be a resinhaving a molecular weight of 30,000 or less such as a polyester resin, apolyester amide resin, a phenoxy resin, or the like.

The external electrodes 131 and 132 may include first and secondexternal electrodes 131 and 132, disposed on the third and fourthsurfaces 3 and 4, respectively.

The first external electrode 131 may include a connection portion Cdisposed on the third surface of the body, and a band portion Bextending from the connection portion to a portion of the first andsecond surfaces. Likewise, the second external electrode 132 may includea connection portion disposed on the fourth surface of the body, and aband portion extending from the connection portion to a portion of thefirst and second surfaces.

In this case, the band portion B may extend not only to a portion of thefirst and second surfaces 1 and 2, but also to a portion of the fifthand sixth surfaces 5 and 6, from the connection portion C.

Hereinafter, the first external electrode 131 will mainly be described,but the second external electrode 132 may have a configurationcorresponding to the first external electrode 131.

Referring to FIG. 5, in the first conductive resin layer 131, a distance(

b) from the third surface 3 of the body 110 to an end of the bandportion of the first conductive resin layers 131 b may be 10 to 20 timesthe thickness (tb) of the first conductive resin layer. For example,10*tb≤

b≤20*tb may be satisfied.

When the distance (

b) is less than 10*tb, the bending strength may be deteriorated. Whenthe distance (

b) is more than 20*tb, the external electrode may become too thick.Therefore, the capacity per unit volume may be lowered.

In addition, in the first external electrode 131, the distance (

b) from the third surface 3 of the body 110 to an end of the bandportion of the first conductive resin layer 131 b may be shorter than adistance (

c) from the third surface 3 of the body 110 to an end of the bandportion of the second conductive resin layer 131 c, and may be longerthan a distance

a) from the third surface 3 of the body 110 to an end of the bandportion of the electrode layer 131 a.

For example, a relation of

a<

b<

c may be satisfied, and the second external electrode 132 may have ashape corresponding to the first external electrode with respect to thefourth surface 4 of the body 110.

Therefore, the electrode layer 131 a may completely cover the firstconductive resin layers 131 b, and the first conductive resin layers 131b may completely cover the second conductive resin layers 131 c. As aresult, the bending strength characteristics, and the adhesion betweenthe external electrode and the body, may be enhanced.

The external electrodes 131 and 132 may further include plated layers131 d and 132 d, disposed on the second conductive resin layers 131 cand 132 c, to improve the mounting characteristics.

For example, the plated layers 131 d and 132 d may be a Nickel (Ni)plated layer or a Tin (Sn) plated layer. The Ni plated layer and the Snplated layer may be sequentially formed on the second conductive resinlayers 131 c and 132 c, and a plurality of Ni plated layers and/or aplurality of Sn plated layers may be included.

Experimental Example

The following Table 1 illustrated a weight ratio of a spherical-typepowder particle to a flake-type powder particle of a metal powdercontained in first and second conductive resin layers, and a liftingphenomenon, occurrence of cracks, and an ESR due to a ratio (tc/tb) in athickness of the second conductive resin layer to the first conductiveresin layer.

The occurrence of cracks of the first and second conductive resin layerswas described by preparing 100 samples per each test number, and, then,by observing the number of cracks when a sample was bent by 5 mm.

Thirty (30) samples were prepared for each test number, and immersed in340° C. lead bath for 20 seconds. Next, the number of lifting phenomenonbetween electrode layers and the conductive resin layers wasinvestigated.

The ESR was measured at resonance frequency using an impedance analyzer.When the impedance was 10 mΩ or less, it was indicated as “OK” whichmeans acceptable. When the impedance was more than 12 mΩ, it wasindicated as “NG” which means not acceptable.

TABLE 1 1^(st) 2^(nd) conductive conductive resin layer resin layerNumber Test Spherical: Spherical: tc/tb lifting of Nos. Flake Flake (%)phenomenon Crack ESR 1 10:90 50:50 20 0 0 OK 2 20:80 60:40 20 0 0 OK 330:70 70:30 20 0 0 OK 4*  0:100 50:50 50 20 8 OK 5* 50:50 — 0 18 80 OK6* 60:50 — 0 75 56 NG 7* 50:50 60:40 20 0 0 NG 8* 30:70 40:60 20 0 10 OK

In the cases of Test Nos. 1 to 3, the weight ratio of the flake-typepowder particle in the metal powder contained in the first conductiveresin layers was 60% or more, and the weight ratio of the spherical-typepowder particle in the metal powder contained in the second conductiveresin layers was 50% or more. As a result, cracks did not occur, and thebending strength characteristics were excellent.

In the case of Test No. 4, the thickness (tc) of the second conductiveresin layers exceeded 30% of the thickness (tb) of the first conductiveresin layer, and the lifting phenomenon and cracks occurred.

In the cases of Test Nos. 5 and 6, the conductive resin layers wereformed in a single-layer structure, instead of a conductive resin layershaving a two-layer structure, and a relatively large amount of liftingphenomenon and cracks occurred.

In the case of Test No. 7, the ratio of the flake-type powder particlein the metal powder contained in the first conductive resin layers wasless than 60%, and the ESR was relatively high.

In the case of Test No. 8, the ratio of the spherical-type powderparticle in the metal powder contained in the second conductive resinlayers was less than 50%, and the cracks occurred.

Therefore, when the ratio of the flake-type powder particle in the metalpowder contained in the first conductive resin layers is 60% or more,and the ratio of the spherical-type powder particle in the metal powdercontained in the second conductive resin layers is 50% or more, it isconfirmed that the ESR was relatively low, and the bending strengthcharacteristics were excellent.

While the present disclosure has been particularly illustrated anddescribed with reference to example embodiments thereof, it can be to beunderstood that the present disclosure is not limited to the disclosedexample embodiments, but on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims. It will be apparent to those skilled inthe art that various substitutions, changes, and modifications in formand details may be made therein without departing from the technicalidea of the present disclosure as defined by the appended claims, andmay be within the scope of the present disclosure.

According to an aspect of the present disclosure, a capacitor componentformed with the conductive resin layers of the external electrode as twolayers having different ratios of the flake-type powder particle and thespherical-type powder particle may be provided, to improve the crackresistance and lifting characteristics, and to lower the equivalentseries resistance (ESR).

It should be understood, however, that the various and advantageousadvantages and effects of the present disclosure are not limited tothose described above, and can be more readily understood in the courseof describing a specific embodiment of the present disclosure.

While example embodiments have been illustrated and described above, itwill be apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A capacitor component comprising: a bodyincluding dielectric layers and internal electrodes alternately arrangedwith the dielectric layers; and external electrodes including electrodelayers disposed on the body and connected to the internal electrodes,first conductive resin layers disposed on the electrode layers, andsecond conductive resin layers disposed on the first conductive resinlayers, wherein the first and second conductive resin layers include ametal powder and a base resin, the first conductive resin layers have alower metal powder content than the second conductive resin layers, themetal powder includes flake-type powder particle and/or spherical-typepowder particle, and a weight ratio of the flake-type powder particle inthe metal powder contained in the first conductive resin layers is 60%or more, and a weight ratio of the spherical-type powder particle in themetal powder contained in the second conductive resin layers is 50% ormore.
 2. The capacitor component according to claim 1, wherein thespherical-type powder particle has a length ratio (major axis/minoraxis) of a major axis to a minor axis of 1.45 or less.
 3. The capacitorcomponent according to claim 1, wherein the flake-type powder particlehas a length ratio (major axis/minor axis) of a major axis to a minoraxis of 1.95 or more.
 4. The capacitor component according to claim 1,wherein the metal powder comprises at least one selected from the groupconsisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.5. The capacitor component according to claim 1, wherein a thickness ofthe second conductive resin layers are 10% or more and 30% or less of athickness of the first conductive resin layers.
 6. The capacitorcomponent according to claim 1, wherein a content of the metal powder inthe first conductive resin layers is 60 wt % or less, and a content ofthe metal powder in the second conductive resin layers is 75 wt % ormore.
 7. The capacitor component according to claim 1, wherein the baseresin included in the first conductive resin layers comprises one ormore selected from the group consisting of an acryl resin, a urethanepolymer, and a core-shell rubber.
 8. The capacitor component accordingto claim 1, wherein the base resin included in the second conductiveresin layers comprises one or more selected from the group consisting ofan ultra-high polymer resin, an oligomer resin, and a highheat-resistant epoxy resin.
 9. The capacitor component according toclaim 1, wherein the electrode layers comprise a conductive metal and aglass.
 10. The capacitor component according to claim 1, wherein theexternal electrodes further comprise a plated layer disposed on thesecond conductive resin layers.
 11. The capacitor component according toclaim 10, wherein the plated layer is a nickel (Ni) plated layer or atin (Sn) plated layer.
 12. The capacitor component according to claim 1,wherein the body comprises first and second surfaces disposed oppositeto each other, third and fourth surfaces connected to the first andsecond surfaces and disposed opposite to each other, and fifth and sixthsurfaces connected to the first to fourth surfaces and disposed oppositeto each other, the external electrodes comprise first and secondexternal electrodes respectively disposed on the third and fourthsurfaces, wherein the first and second external electrodes include aband portion extending to a portion of the first and second surfaces,and in the first external electrode, a distance between the thirdsurface and an end of the band portion in the first conductive resinlayer is 10 to 20 times a thickness of the first conductive resin layer.13. The capacitor component according to claim 12, wherein, in the firstexternal electrode, the distance between the third surface and an end ofthe band portion in the first conductive resin layer is shorter than adistance between the third surface and an end of the band portion in thesecond conductive resin layer, and is longer than a distance between thethird surface and an end of the band portion in the electrode layer. 14.The capacitor component according to claim 1, wherein the weight ratioof the flake-type powder particle in the metal powder contained in thefirst conductive resin layers is more than a weight ratio of thespherical-type powder particle in the metal powder contained in thefirst conductive resin layers.
 15. The capacitor component according toclaim 1, wherein the weight ratio of the spherical-type powder particlein the metal powder contained in the second conductive resin layers isequal to or more than a weight ratio of the flake-type powder particlein the metal powder contained in the second conductive resin layers.